Tesla's Dojo supercomputing platform will be put into mass production in July. It uses fan-out wafer-level packaging technology. Does the company have this technology?

Changdian Technology: Dear investors, hello. Changdian Technology is an industry leader in providing a full range of wafer-level technology solution platforms. It has many years of mass production experience and provides products including fan-in wafer-level packaging (FIWLP), fan-out wafer-level packaging (FIWLP) and fan-out wafer-level packaging (FIWLP). FOWLP), integrated passive devices (IPD), through silicon vias (TSV), encapsulated chip packaging (ECP), and radio frequency identification (RFID) solutions. The company launched XDFOI? a full range of extremely high-density fan-out packaging solutions in 2021, which can provide domestic and foreign customers with turnkey services from design to production of high-density fan-out wafer-level packaging, helping customers significantly improve their chips. System integration, providing excellent microsystem integration solutions for high-performance computing applications. Thank you for your interest in the company.