Well-known analyst Ming-Chi Kuo commented that the company will benefit from Apple's iPhone UWB process upgrade and Nvidia's H100 advanced packaging. Is this true?

Changdian Technology: Dear investors, hello. Changdian Technology has the industry's leading SiP technology platform, which can create customized smart terminal SIP packaging and testing solutions for customers based on various terminal application scenarios. It has significant advantages such as high-density integration and high product yield. This includes packaging of UWB-related products and achieving large-scale shipments. At the same time, Changdian Technology can also provide a series of packaging and testing solutions for high-performance computing. Currently, the XDFOI? Chiplet high-density multi-dimensional heterogeneous integration series process has entered the stable mass production stage. Thank you for your interest in the company.