快报列表

Primemas adopts Achronix eFPGA IP for chiplet technology 2025-01-16 03:20
Application prospects of chiplet technology in the automotive industry 2025-01-04 12:33
Hello, Secretary Dong, ① Are your high-density packaging technologies such as 3D stacking and TSV ready for mass production? If not, what stage is the development currently in? ② What are the gross profit margins and revenue share of your traditional packaging (through-hole insertion, surface mount) and advanced packaging (area matrix packaging, SiP, high-density packaging)? ③ Your company's revenue in the third quarter increased by 19% year-on-year, but net profit attributable to shareholders increased by 99% year-on-year. What is the main reason for the increase in net profit in the third qu 2024-12-31 19:20
Hello, is your company involved in the formulation of the "Small Chip Interface Bus Technology" standard? Can your company's technology currently meet the standard requirements? What is the impact of the launch of this standard on the domestic chip manufacturing and packaging industry? Thank you. 2024-12-31 18:02
Could you please tell me about Changdian Technology’s R&D and application of chiplet technology? 2024-12-31 17:56
Does your company have any forecasts for the future growth of the chiplet market? How much impact will chiplets have on your company's performance? 2024-12-31 16:39
At the "Second China Interconnect Technology and Industry Conference" on December 16, the first group standard "Technical Requirements for Chiplet Interface Bus" jointly developed by relevant Chinese integrated circuit companies and experts was officially approved and released by the China Electronics Industry Standardization Association of the Ministry of Industry and Information Technology. This is China's first native chiplet technology standard. As a leading company in the industry, did your company participate in the formulation of this standard? 2024-12-31 16:16
Your company has recently achieved the simultaneous shipment of 4-nanometer node multi-chip system-integrated packaging products, with the largest package area being about 1,500 square millimeters. Regarding this 4-nanometer multi-chip system-integrated packaging product and the packaging area of ​​up to 1,500 square millimeters, can your company introduce more technical details of the packaging method used this time, how many chips are integrated in this area, and whether it is a two-dimensional method or a stacked method? Thank you for your answer. 2024-12-31 15:43
What projects are the company currently building, what is the progress, and when can they be put into production? 2024-12-31 14:33
Please introduce the company's advantages in high-performance computing. Thank you. 2024-12-31 14:19
Well-known analyst Ming-Chi Kuo commented that the company will benefit from Apple's iPhone UWB process upgrade and Nvidia's H100 advanced packaging. Is this true? 2024-12-31 13:02
Intel launched the Core Ultra "MeteorLake" CPU based on the storage and computing separation architecture, which uniformly encapsulates various IPs in the form of chiplets. I understand that your company cannot comment on a single product or customer. Regarding the advanced chiplet packaging, does Changdian currently have any cooperation with major domestic and foreign customers in terms of advanced product development and launch? In addition, foreign chip manufacturers are actively using chiplets to develop new products, and the performance is very good. From your perspective, how is the over 2024-12-31 11:12
What is the current mass production status of XDFOI? Can you tell us about your expectations? Your company's stock price has plummeted by more than 10% in the past three days. Have the fundamentals changed? 2024-12-31 11:04
Your company's 2.5D and 3D advanced packaging are currently in the mass production stage. How are these two compared to the previous two years? Have they increased in volume? Can you give us a rough idea of ​​how much higher the profit margin of 2.5D and 3D packaging is than that of traditional packaging? 2024-12-31 10:42
Does the company currently have any applications or reserves of CoWos packaging technology? 2024-12-31 09:35