What customers or products does the company's SiP technology have? What advantages does it have compared to other companies?

Changdian Technology: Dear investors, hello. With the breakthrough and mass production of chiplet packaging and testing technology, heterogeneous SiP technology has also accelerated its penetration into the field of SoC development. The company's SiP technology is widely used in various semiconductor devices such as radio frequency front-end, low-power Bluetooth, WiFi, radar, sensors, power management chips and storage. Changdian Technology has carried out technical cooperation in the field of high-density SiP with many major customers at home and abroad. It has a complete SiP technology platform and rich product mass production experience for different downstream applications. We can create customized smart terminal SiP packaging and testing solutions for customers based on different terminal application scenarios, providing turnkey services from packaging collaborative design, simulation, manufacturing to testing, with high-density integration and high product yield. advantage. Changdian Technology is the first in the industry to launch double-sided SiP technology, which further reduces the area of ​​the device by 40% compared to single-sided SiP, shortens the signal transmission path and reduces material costs. The company can also flexibly use conformal and split-cavity shielding technologies to effectively improve the EMI performance of packaged modules. Thank you for your interest in the company.