Please introduce the company's advantages in high-performance computing. Thank you.

Changdian Technology: Dear investors, hello. In the field of high-performance packaging, Changdian Technology has launched the Chiplet high-performance packaging technology platform XDFOI? for high-performance computing and other fields. Currently, JCET's high-density fan-out integrated packaging technology can provide turnkey services from design to production, helping customers significantly improve chip system integration and provide excellent microsystem integration solutions for high-performance computing applications. The company is also continuing to invest in the development of diversified solutions related to computing power chips and related production capacity construction. Thank you for your interest in the company.