At the "Second China Interconnect Technology and Industry Conference" on December 16, the first group standard "Technical Requirements for Chiplet Interface Bus" jointly developed by relevant Chinese integrated circuit companies and experts was officially approved and released by the China Electronics Industry Standardization Association of the Ministry of Industry and Information Technology. This is China's first native chiplet technology standard. As a leading company in the industry, did your company participate in the formulation of this standard?

Changdian Technology: Dear investors, the company has participated in the above conference and made a keynote speech on the discussion of chiplet packaging technology. The company also actively supports and participates in the formulation of chiplet interconnection standards worldwide. For example, the company has joined the UCIe (Universal Chiplet Interconnect Express) industry alliance in June 2022. Changdian Technology will fully rely on its own advantages, in terms of technology accumulation, innovation and industrialization capabilities, and actively work with other member companies of the alliance to promote the standardization of chiplet interface specifications, and realize technology and application innovation guided by market demand. Thank you for your attention and support to the company.