Samsung released GDDR6W video memory at the end of last month, saying that its bandwidth and capacity have doubled, and introduced the new GDDR6W video memory: using fan-out wafer-level packaging (FOWLP) technology, it greatly improves memory bandwidth and capacity. Does Changdian Technology have FOWLP packaging technology? Does your company have a cooperative relationship with Samsung? Does your company currently have a video memory packaging business?

Changdian Technology: Dear investors, hello. Changdian Technology is in the leading position in the industry in providing a full range of wafer-level technology solution platforms, including fan-in wafer-level packaging (FIWLP), fan-out wafer-level packaging (FOWLP), integrated passive devices (IPD), through silicon vias (TSV), encapsulated chip packaging (ECP), and radio frequency identification (RFID). Most of the top 20 semiconductor companies in the world are customers of the company. Changdian Technology has extensive cooperation with most of the leading storage manufacturers at home and abroad. Its products include NAND flash memory and DDR dynamic random access memory products, LPDDR, uMCP and eMCP for DRAM in mobile electronic products, etc. Thank you for your attention and support to the company.