What is the most advanced packaging technology of Changdian Technology? How many nanometers can it achieve? The exclusive packaging technology currently advertised by Dimensity 9000 can increase its heat dissipation capacity by 10%. Can Changdian Technology's related technologies achieve this?

Changdian Technology: Dear investors, hello. The company has already implemented the packaging of mobile phone chips using the 4nm process. We work with customers on chip and package design to deliver products that meet their performance, quality, cycle and cost requirements. Our comprehensive wafer-level technology platform provides customers with a variety of options to help customers integrate various advanced packages such as 2.5D and 3D into advanced mobile devices such as smartphones and tablets, helping different customers achieve higher integration levels. , module functions and smaller size packaging technology requirements. In the technical solution to improve heat dissipation performance, we work with industry customers to promote chip, package and system co-design to achieve joint optimization of cost and performance. In terms of finished product manufacturing technology, we apply chip backside metallization technology to advanced packaging to significantly improve system thermal conductivity. The backside metallization technology developed by Changdian Technology can not only improve the heat dissipation of the package, but also enhance the electromagnetic shielding capability of the package according to design needs. The company has applied chip backside metallization technology and its manufacturing process to high-volume mass production lines. Thank you for your interest in the company.