Is your company one of the top ten chip packaging and testing companies in the world? In terms of advanced packaging technology, have you achieved full coverage of mainstream technology platforms? Thank you

Changdian Technology: Dear investors, hello. Changdian Technology is a world-leading integrated circuit manufacturing and technology service provider, providing a full range of one-stop services for chip finished product manufacturing. According to the 2021 Global Outsourced Packaging and Testing (OSAT) list released by ChipInsights, Changdian Technology ranks third among the top ten OSAT manufacturers in the world and first in mainland China. The company can provide a full range of one-stop services for chip finished product manufacturing. Through highly integrated wafer-level WLP, 2.5D/3D, system-level (SiP) packaging technology and high-performance FlipChip and lead interconnect packaging technology, Changdian Technology's products, services and technologies cover mainstream integrated circuit system applications, including network communications, mobile terminals, high-performance computing, automotive electronics, big data storage, artificial intelligence and the Internet of Things, industrial intelligent manufacturing and other fields. Thank you for your attention and support to the company.