Hello, could you please introduce your company's advanced packaging technology technology reserves in the post-Moore era? What is the production capacity planning? What is the room for improvement or enhancement in the current industry competition landscape?

Changdian Technology: Hello, as electronic products are further developed towards miniaturization and multi-function, the chip size is getting smaller and smaller, and the chip types are increasing. The number of input and output pins has increased significantly, making the development of 2.5D/3D packaging, fan-shaped packaging (FOWLP/PLP), micro-pitch wire bonding technology, and system packaging (SiP) technology one of the best choices to continue Moore's Law. The semiconductor packaging and testing industry is also transitioning from traditional packaging and testing to advanced packaging and testing technology, and the proportion of advanced packaging technology in the entire packaging market is gradually increasing. In recent years, the company has focused on the development of advanced packaging technologies such as system-level (SiP), wafer-level, and stacked packaging, and has achieved large-scale production. At the same time, it continues to increase investment in the research and development of advanced packaging processes and products, develop some popular packaging types that are rapidly developing in automotive electronics and big data storage, actively build a new business platform for design services, and continuously strengthen Changdian Technology's core competitiveness and implement it at the factory end. Thank you!