Qinghe Jingyuan's high-end wafer bonding equipment passed customer acceptance and achieved batch delivery

On November 1, the high-end wafer bonding equipment independently developed by Qinghe Jingyuan successfully passed the customer acceptance and achieved mass delivery. In July this year, the company completed a financing of 300 million yuan, which will be used to build advanced bonding equipment and bonding substrate production lines. Qinghe Jingyuan plans to further expand its production scale and expand the annual production capacity of advanced bonding equipment to 60 units (sets) to meet the growing market demand. At the same time, the company will build a new 8-inch SiC bonding substrate production line with an annual output of 400,000 pieces to accelerate the mass production of 8-inch SiC substrates and further consolidate its leading position in the field of bonding integration technology.