Renesas Electronics and Honda Collaborate to Develop High-Performance System-on-Chip

Renesas Electronics announced that it has signed an agreement with Honda to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs). This new SoC will use TSMC's 3nm process and a system using multi-die chiplet technology, combining Renesas' Gen 5 R-Car X5 SoC series with Honda's independently developed AI accelerator optimized for AI software, aiming to provide 2000 TOPS of AI performance and 20TOPS/W of power efficiency, and is planned for future models of Honda's new electric vehicle "Honda Zero Series".