Changdian Technology builds advanced packaging base in Shanghai Lingang

Changdian Technology is accelerating the construction of its first advanced packaging base for mass production of automotive-grade chip products in Lingang, Shanghai, aiming to serve customers and partners in the automotive electronics field at home and abroad. The base will be equipped with a highly automated automotive chip production line and establish a complete automotive-grade business process. Changdian Technology's chiplet packaging node has successfully broken through 4nm, reaching the industry-leading level. At the same time, the company has made significant progress in RDL technology, achieving 5-layer wiring technology, keeping pace with the global leader ASE, and only slightly inferior to TSMC's 6-layer wiring technology.