Shenghe Jingwei completed US$700 million in financing to promote the development of automotive chip business

On December 31, 2024, Shenghe Jingwei Semiconductor Co., Ltd. announced that the $700 million private placement financing for patient capital has been successfully delivered. The newly added investors include Wuxi Industrial Development Science and Technology Innovation Fund, Jiangyin Binjiang Chengyuan Investment Group, Shanghai Guotou Futeng Capital, Shanghai International Group, Shanghai Lingang New Area Management Committee Xinxin Fund and Lingang Group Digital Science Fund, as well as Social Security Fund Zhongguancun Independent Innovation Fund, China Life Equity Investment, Golden Link, etc. Since its establishment in 2014, Shenghe Jingwei has been focusing on providing high-quality 12-inch bump and rewiring processing services, committed to mid-stage silicon wafer manufacturing and testing services, and further developing advanced 3D system integrated chip business. The company has developed rapidly, especially in 2023 and 2024, when the company's revenue has increased significantly for two consecutive years.