TSMC and Creative Electronics win large order for next-generation HBM4 basic interface chip

TSMC and its subsidiary Creative Electronics have successfully obtained a large order for the next-generation HBM4 basic interface chip. With the growing demand for artificial intelligence, the demand for high-speed computing and high-bandwidth memory is becoming increasingly strong, which has become an emerging business opportunity in the market. The three major memory chip manufacturers SK Hynix, Samsung and Micron are actively investing in this field. At present, the production capacity of HBM3/HBM3e is in short supply, and the existing HBM3/HBM3e capacity and speed limitations put the new generation of AI chips at risk of not being able to fully utilize their computing power. In response to this problem, the three manufacturers have increased capital expenditures and started to develop the next-generation HBM4 products, with the goal of achieving mass production by the end of 2025 and starting mass shipments in 2026.