U.S. Department of Commerce invests $1.4 billion in advanced packaging

The U.S. Department of Commerce has finalized $1.4 billion in incentives to strengthen U.S. leadership in advanced packaging and ensure the validation of new technologies and the large-scale transition to U.S. manufacturing. These subsidies will help build a self-sufficient, high-volume domestic advanced packaging industry in which advanced-node chips are manufactured and packaged in the United States.