Intel leads the development of glass substrate technology

As a pioneer in glass substrate technology, Intel plans to mass-produce advanced packaging glass substrates between 2026 and 2030, and has invested approximately $1 billion to establish a glass substrate R&D line and supply chain at its Arizona plant. This technological innovation took more than a decade of research to perfect, and is expected to increase the chip area in a single package by 50% and increase the interconnection density by 10 times.