Micron purchases TC bonder for HBM3E production

Micron purchased TC bonders from Japan's Shinkawa Semiconductor and Hanmi Semiconductor for the production of HBM3E, and placed a TC Bonder purchase order worth 22.6 billion won to Hanmi Semiconductor in April this year. It is reported that Micron is using the thermal compression non-conductive film (TC-NCF) process to manufacture HBM3E, which is likely to be adopted in the next-generation product HBM4.