快报列表

1) I see that companies are planning to package and test memory chips such as DRAM and NAND. What are the differences in the packaging and testing processes and equipment required for these two products? Are the barriers to entry high for other packaging and testing companies that focus on a certain product, or even IC design companies? 2) Are there any differences in the processes and equipment required for memory packaging and testing and logic chip packaging and testing? 2024-12-31 11:54
Huawei's DE-i range extender generator technology is very similar to BYD's Xiaoyun generator technology. Do BYD and Huawei have any patent authorization or technology exchange on this range extender technology? If there is any technology exchange, what kind of exchange is it? 2024-12-27 23:03
ICP Semiconductor Chiplet Packaging Technology Platform COORS 2024-12-27 03:53
Main range extender models and vehicle types 2024-12-26 19:31
Yizumi seizes the opportunities in the new energy vehicle industry and develops large-scale die-casting intelligent equipment industry 2024-12-26 18:15
Tsinghua University and Harbin Institute of Technology jointly proposed a large model 1bit extreme compression framework OneBit 2024-12-26 05:05
Zhizhan Technology and STMicroelectronics Collaborate on Developing SiC Electric Compressor Controllers 2024-12-26 03:22
ION solid-state battery uses 3D ceramic structure technology 2024-12-26 02:29
ThunderSoft achieves end-to-end operation of 13 billion parameter models 2024-12-20 21:36
Jianzhi Robotics' PhiAD autonomous driving model is selected by a car company 2024-12-20 20:20
1. Does your company have core technologies and barriers that do not rely on third parties in large models? 2. What industry-leading products does your company have in intelligent driving? 3. Which direction is your company's main business? 4. I suggest that your company learn more from Desay SV and make achievements in its main business, instead of following Doerr's example. 2024-12-20 19:41
Apple acquires Datakalab 2024-12-20 12:27
GAC Aion releases version 2.0 of the magazine battery 2024-12-20 11:22
Lattice Demonstrates Low-Power FPGA Technology for Automotive Applications 2024-12-19 18:34
United Electronics faces short-term obstacles in the 800V product field, and the proportion of self-production by OEMs increases 2024-07-30 12:10