Jiangsu Pangu Semiconductor Technology Co., Ltd. laid the foundation stone for the multi-chip high-density board-level fan-out packaging industrialization project

On June 30, Jiangsu Pangu Semiconductor Technology Co., Ltd. held a groundbreaking ceremony for its multi-chip high-density board-level fan-out packaging industrialization project, marking the project's entry into the full construction phase. This project will focus on the development and application of board-level packaging technology and build the world's first fully automatic board-level packaging production line. It is understood that the total investment in the project is expected to be 3 billion yuan, and it will be built in two phases. The first phase of construction will be from 2024 to 2028, and a total area of ​​approximately 120,000 square meters of plant buildings and related ancillary facilities will be built to promote the development and application of board-level packaging technology. It is expected that partial production will begin in 2025. After the project reaches full production, the annual output value is expected to be no less than 900 million yuan, and the annual economic contribution will be no less than 40 million yuan.