Han's Semiconductor Launches SiC Ingot Laser Slicer

Guangdong Han's Semiconductor Equipment Technology Co., Ltd. has launched the SiC ingot laser slicer HSET-S-LS6200, which integrates a self-developed high-power femtosecond laser system. It can process ingots up to 5 cm thick and supports a maximum processing size of 8 inches, which is expected to reduce production costs by 73%.