Qinghe Jingyuan completed financing of over 300 million yuan

Recently, Qinghe Jingyuan announced that it has completed a round of financing of more than 300 million yuan. This round of financing was participated by investors such as Shenzhen Capital Group, Yuanzhi Spark, and Xinpengwei, and old shareholders Zhengwei Capital, Core Dynamic Energy, and Tianchuang Capital continued to support. Qinghe Jingyuan stated that the financing will be used to expand the construction of its advanced bonding equipment and bonding substrate production lines to meet the growing market demand. Qinghe Jingyuan plans to continue to expand its production scale and expand the annual production capacity of advanced bonding equipment to 60 units (sets) to meet the growing customer demand. In addition, the company also plans to build a new 400,000-piece 8-inch SiC bonding substrate production line to accelerate the mass production of 8-inch SiC substrates and consolidate its leading position in the field of bonding integration technology.