TSMC's 2nm process is progressing smoothly

TSMC plans to start trial production of 2nm process chips at its wafer fab in Baoshan, Hsinchu next week, a quarter ahead of market expectations. The trial production will include the equipment and components required for testing, which have been installed since the second quarter. TSMC said that the 2nm process has a 10% to 15% performance improvement over the 3nm process and a maximum 30% reduction in power consumption. TSMC will start applying the GAA nanosheet transistor structure from the 2nm process and introduce backside power supply (BSPR) technology, and mass production is expected to begin in 2026.