Many companies are deploying FOPLP technology

Many companies are actively deploying FOPLP technology, including Kexiang Co., Ltd., Wenyi Technology and Huahai Chengke. Kexiang Co., Ltd.'s panel-level packaging PLP process can be applied to 3D packaging-related products, Wenyi Technology is developing new technologies, including panel-level fan-out packaging-related technologies, and Huahai Chengke's related products in the field of advanced packaging are gradually passing customer assessments and verifications, and are expected to be gradually industrialized.