Hong Kong, China welcomes its first semiconductor wafer fab project using silicon carbide technology

In January this year, Hong Kong, China welcomed its first semiconductor wafer factory project. J-Cube Semiconductor (Hong Kong) Co., Ltd. signed a memorandum of cooperation with the Federation of Hong Kong Industries, planning to use the third-generation semiconductor silicon carbide technology to build an 8-inch wafer factory in Hong Kong. The total investment of the project is expected to reach HK$6.9 billion. After reaching full production, it will produce 240,000 wafers per year, which will be able to meet the production needs of 1.5 million new energy vehicles.