Lingming Photonics received C2 round of financing to promote the aggregation of intelligent industry

Lingming Photonics, a company focusing on the research and development of high-end 3D camera chips, completed its C2 round of financing in the first half of 2024, with the support of Jintou Dingxin, a subsidiary of Zhejiang Jinkong. The company has successfully entered the supply chain of many leading Chinese companies and achieved mass production and shipment of high-end chip projects. Its products are widely used in smart cars, high-end mobile phones, robots and other fields. At present, the company is developing multi-million-pixel area array chips, which are expected to be launched in the future.