Hong Kong Science and Technology Parks not a memorandum of understanding with Chinese chip company J-Square Semiconductor

Hong Kong Science and Technology Parks memoriale intellegendi cum continenti Sinarum chip societas Jiefang Semiconductoris signavit, cum propositum primum Hongcongum SiC 8 inch laganum fab et novam tertiam generationem semiconductorem R&D constituendi. Jiefang Semiconductor obligavit se obsidere HK$6,9 miliardis in incepto et consiliis ad consequendam facultatem productionis annuae 240.000 laganae ab 2028'.