TSMC expands FOPLP research and development efforts, expects to achieve results within three years

TSMC is actively promoting the research and development of FOPLP and has established a dedicated R&D team and production line. Although it is still in its early stages, significant results are expected to be achieved in the next three years. In addition to TSMC, many Taiwanese manufacturers including ASE, Powertech, and Innolux are also actively deploying advanced packaging solutions such as FOPLP. They hope that in this way they can gain a foothold in the future advanced packaging market.