ASE establishes FOPLP production line in Kaohsiung to promote the development of AI chip industry

ASE invested US$200 million to set up a FOPLP mass production line in Kaohsiung, and will start trial production at the end of the year. With the gradual advancement of the production line, it is expected to provide more solid packaging technology support for the development of the global AI chip industry. FOPLP advanced packaging products are mainly used in power management IC (PMIC), radio frequency IC (RF IC), CPU, GPU and AI GPU.