TSMC izmanto ārpakalpojumus WoS jaudai CoWoS uzlabotajā iepakojumā

Due to its limited production capacity, TSMC has outsourced the WoS (Wafer on Substrate) capacity of the CoWoS advanced packaging. Not only has ASE Technology Holding taken a large number of advanced packaging and testing orders, but King Yuan Electronics has also won a large number of front-end wafer testing (CP) and back-end wafer final testing (FT) orders from high-speed computing customers, filling up King Yuan Electronics' existing production capacity.