Infineon Technologies develops world's thinnest silicon power wafer

Infineon Technologies announced on October 29 that they have made a breakthrough in handling and processing the world's thinnest silicon power wafers. This wafer, with a diameter of 300mm and a thickness of only 20μm, is only a quarter of the thickness of a hair and is thinner than half the thickness of the current most advanced 40-60μm wafers.