Guangdong's Optical Chip Industry Innovation and Development Action Plan proposes three major strategies

The Action Plan proposes three major strategies, including supporting optical chip design companies to strengthen R&D and industrialization layout in the fields of optical communication interconnection transceiver chips, FP/DFB/EML/VCSEL laser chips, PIN/APD detection chips, short-wave infrared organic imaging chips, TOF/FMCW lidar chips, and 3D visual perception chips; vigorously supporting technologically advanced optical chip IDM and Foundry companies; increasing the production line and capacity layout of optical chips, optical modules and optical devices based on platform materials such as silicon-based, germanium-based, compound semiconductors, and thin-film lithium niobate, as well as heterogeneous and heterogeneous integration of various materials and multi-functional optoelectronic integration; vigorously developing advanced packaging technologies such as on-chip integration, 3D stacking, co-packaging (CPO) of lightwave devices and optical chips, and optical I/O interfaces; and closely following market demand to promote the upgrading of optical chip packaging and testing process technology and enhancement of capabilities.