Runxin Technology and Qiyi Moore signed a CoWoS-S heterogeneous integration packaging service agreement

Runxin Technology announced that it had signed an agreement with SGMoore on CoWoS-S heterogeneous integrated packaging services on October 28. According to the agreement, Runxin Technology will provide SGMoore with CoWoS-S packaging projects, integrate chip resources such as storage and computing, and complete packaging and testing and tape-out in advanced packaging plants. Runxin Technology will also assist SGMoore in finding advanced packaging plants and other supporting chip resources that meet its needs. The delivery time of the first batch of computing chips is scheduled for March 2025.