TSMC has made a major breakthrough in panel-level packaging technology and is expected to achieve small-scale mass production in 2027

According to reports, TSMC, the world's leading semiconductor manufacturer, has made key progress in panel-level packaging (PLP) technology. The technology is now close to completion and is expected to be mass-produced in small batches around 2027. TSMC's move is aimed at responding to the urgent need for higher performance and higher integration of artificial intelligence chips.