Infineon's new high-voltage IGBT chip will be put into mass production by the end of the year

Infineon will start production of its latest high-voltage IGBT chips, including the third-generation EDT3 and 800V-specific RC-IGBT chips, at the end of the year. These chips are designed to improve the efficiency of electric vehicles, thereby increasing the range. EDT3 reduces losses by 20% compared to the previous generation, while improving high and low load efficiency, increasing the range by 5%-8%. The RC-IGBT optimizes space and power density through integrated design, making it suitable for high-end 800V models.