Zhenqu Technology completes signing of 600 million yuan syndicated loan

On May 20, Zhenqu Technology held a signing ceremony for a 600 million yuan syndicated loan at its headquarters in Kangqiao, Shanghai. The loan was exclusively arranged by Shanghai Science and Technology Bank as the lead and bookkeeping bank, and several banks jointly completed the capital investment. Zhenqu Technology said that the funds will be used to accelerate the research and development and capacity improvement of IGBT/SiC power modules and next-generation electric control platforms, further consolidating its technological leadership in the industry.