SK Hynix plans to mass produce the latest HBM4 memory in October

SK Hynix will start mass production of the latest HBM4 memory in October this year to meet the needs of Nvidia's "Rubin" architecture AI GPU to be launched next year. This 12Hi HBM4 memory uses 12 layers of 24Gb DRAM chips stacked together, with a single package capacity of 36GB and a bandwidth of up to 2TB/s. It is reported that SK Hynix's yield rate on HBM4 has increased from more than 60% at the beginning of the year to 70% recently, laying a solid foundation for mass production.