Nvidia confirms Blackwell chip packaging process changes

Nvidia CEO Jensen Huang recently confirmed that the company is adjusting its advanced packaging process selection at TSMC. Nvidia's latest generation of artificial intelligence chips, Blackwell, will be packaged using chip-on-wafer-on-substrate (CoWoS) technology. According to an analysis report, the majority of Blackwell's packaging will use CoWoS-L rather than the more expensive CoWoS-S.