Xinmeng Technology completes new financing

Xinmeng Technology recently completed a new round of financing. Founded in November 2018, Xinmeng Technology is a technology platform company specializing in heterogeneous integrated chips. Xinmeng Technology boasts world-leading vertical channel 3D memory and HITOC™ bonding density. Its team has extensive experience in the design, production, bonding, and packaging of the entire 3D heterogeneous industry chain.