SiCSem establishes its first end-to-end SiC chip manufacturing facility in India

SiCSem has launched the groundbreaking ceremony for the country's first end-to-end silicon carbide semiconductor manufacturing facility in Odisha, India. The facility represents a total investment of approximately ₹206.7 billion and is expected to be operational between 2027 and 2028. The facility aims to process 60,000 SiC wafers annually.