TSMC N2 process chip mass production begins

TSMC announced that it has begun mass production of chips using its N2 (2nm-class) process, which employs first-generation nanosheet transistor technology and achieves full-node improvements in performance and power consumption. TSMC has also developed a low-resistance redistribution layer (RDL) and ultra-high-performance metal-insulator-metal (MiM) capacitors to further enhance performance.