ESW Computing showcases automotive-grade chips at the High-Level Forum on the Development of Intelligent Electric Vehicles

At the High-Level Forum on the Development of Intelligent Electric Vehicles held in Beijing in 2026, ESW Computing showcased its automotive-grade chips and supporting demonstration solutions. These chips include a CMS (electronic rearview mirror) chip and demo, an automotive MCU, and a SerDes (video transmission) chip, suitable for core automotive applications such as smart cockpits and body control. ESW Computing's chips have passed stringent automotive-grade certifications, comply with the AEC-Q100 standard, and meet ASIL-B functional safety level requirements.