Lingming Photonics Completes RMB100 Million C+ Round of Financing

Lingming Photonics, a 3D sensor chip supplier, recently completed a C+ round of financing worth hundreds of millions of yuan, with investments from Cornerstone Capital, Guyu Jiahe Capital and other institutions, and Guangyuan Capital as financial advisor. Lingming Photonics focuses on dToF technology, has hundreds of domestic and foreign patents, and its products cover multiple fields such as automotive lidar, smartphones, and XR headsets. The company has cooperated with many partners in the automotive field to promote the development of three-dimensional perception of smart cars.