Gowin Semiconductor showcases its latest technology

Gowin Semiconductor participated in the SOC-IP 2023 annual exhibition held in Santa Clara, California, USA, and demonstrated its latest UAC2.0 audio system solution. The solution uses the GOWIN GW1N-LV9LQ144 FPGA chip and integrates on-chip USB PHY function. By connecting a DAC device with an I2S interface, audio playback quality up to 32-bit/192kbps can be achieved.