快报列表

Microchip Launches New PolarFire FPGA and SoC Product Line with 30% Price Drop 2025-05-21 20:50
Zhongke Xinci Technology completes Series B financing to accelerate chip development 2025-05-20 10:11
Domestic FPGA chip company Unigroup Technologies starts A-share listing process 2025-05-07 08:30
Zhiduojing LPC_Controller IP leads the new trend of automotive data transmission 2025-04-17 17:11
Allwinner Technology excels in ASIC chip field 2025-01-22 12:32
Primemas adopts Achronix eFPGA IP for chiplet technology 2025-01-16 03:20
Suzhou Yige Technology completed hundreds of millions of yuan in Pre-A+ round of financing 2025-01-08 22:30
Two ways to reconfigure FPGA chips 2025-01-01 17:26
Algorithms adapt to chip architectures to promote the development of mainstream architectures for autonomous driving SoCs 2025-01-01 00:13
Hello, Secretary Dong! Is your company's silicon-free through-silicon via wafer-level ultra-high density packaging technology ready for mass production? 2024-12-31 20:04
Dear Secretary, Tesla recently launched the Dojo chip. It is understood that TSMC's excellent packaging technology - wafer integrated fan-out system (InFO_SoW) played an extremely critical role in it. So, I would like to ask whether your company currently has the technology to replace TSMC in this regard. If you do not currently have the technology to package Dojo, then what stage is your company's technology currently at? Thank you. 2024-12-31 19:45
Competition between FPGA and ASIC in semiconductor design is becoming increasingly fierce 2024-12-30 23:41
Lattice CEO Anderson resigns and joins Coherent as new CEO 2024-12-30 09:55
Zhuhai Zuanxin successfully achieved 28nm FPGA tape-out 2024-12-28 08:48
Altera faces huge market opportunities and actively expands into other markets 2024-12-28 07:21