Infineon launches innovative cold cutting technology

In response to the demand for SiC in the new energy vehicle and photovoltaic energy storage markets, Infineon has launched cold cutting technology, which effectively improves the utilization rate of silicon carbide wafers. By signing long-term supply agreements with multiple wafer fabs, and cooperating with Beijing Tianke Heda Semiconductor Co., Ltd. and Shandong Tianyue Advanced Technology Co., Ltd. In addition, Infineon is also expanding its silicon carbide production capacity in Europe and Asia, and plans to apply cold cutting technology to the back thinning process in the next two years. It is expected that by 2027, Infineon's silicon carbide production capacity will increase tenfold.