Infineon's 1200V CoolSiC™ Boost EasyPACK™ moduli industriam photovoltaicam adiuvat

2024-12-20 09:24
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Infineon novum 1200V CoolSiC™ Boost EasyPACK™ moduli, utens M1H technologiae chippis, in promptu est in 5 differentibus specificationibus, cum humili in resistentia et acus pressFIT crimp design. Modus hic modulus commoda princeps systematis efficientiae et humilis sumptus habet, apta ad industriam photovoltaicam faciens.