快报列表

Haining Liandongxin 6-inch microwave RF chip and device project officially put into production 2024-12-25 21:52
Wang Minwen, chairman of Lianwei Micro, said that the project has achieved a breakthrough from scratch 2024-12-25 21:52
Haining Liandongxin Project is the new base for Lianwei's compound semiconductor RF chip business 2024-12-25 21:51
Leon Micro's compound semiconductor RF chip business segment is developing rapidly 2024-12-25 21:51
Cross-border mergers and acquisitions of semiconductor assets by multiple companies have attracted attention 2024-12-25 13:24
The production capacity of the Hangzhou base of Lianwei reaches 90,000 pieces/year, and the Haining base is expected to be put into production in the fourth quarter of 2024 2024-12-25 11:25
The 12-inch silicon wafer production capacity of the Lianwei Jiaxing base has been increased to 150,000 pieces per month 2024-08-23 13:14