NVIDIA's development in 3D packaging and chiplets

Although NVIDIA proposed the MCM design in 2017, its development in 3D packaging and chiplets has been relatively slow. NVIDIA is currently one of TSMC's main customers for 2.5D packaging CoWoS, but has not yet adopted TSMC's SoIC technology. However, there are reports that NVIDIA will fully adopt the chiplet design in the next-generation Blackwell GB100 GPU.