Zonghui Xingguang completed the capping of the "3-inch compound semiconductor chip manufacturing project"

On October 23, Zonghui Xingguang announced that its "3-inch compound semiconductor chip manufacturing project" has been capped. The project has a total investment of 550 million yuan, a planned land area of ​​40 mu, and is expected to start production in January next year. After production, the project will have an annual production capacity of about 50 million 3-inch gallium arsenide chips and 3-inch indium phosphide chips.